Our latest thermal technology, Advanced Alienware Cryo-Tech, is an engineering approach where an Alienware system’s gaming performance is never compromised by means of electrical and mechanical methods while maintaining system stability during the highest performance states. This is managed using methods, not limited to, heat dissipation through creative thermal module designs, fan and fan motor design, as well as exhaust and intake layouts and overall airflow impedance. This generation has also been upgraded with an 9mm diameter increase in the CPU fan blades and 4mm diameter increase in the GPU fan blades. In addition, the new m15 offers improved airflow by directly channeling the cooler air onto the most sensitive cores of the system.
With all the latest engineering enhancements, you can expect increased power efficiency and higher speeds for longer sustained periods. Here’s a closer look at our innovative cooling solution:
Vapor Chamber Technology: Alienware’s new Vapor Chamber Technology uses advanced methods to efficiently dissipate heat. The new Alienware m15 is engineered with a dedicated vapor chamber in between the CPU and copper heat pipes. It's all designed to manage the thermal flow and maximize performance. These chambers utilize the phase-changing nature of liquid to transfer heat more effectively than a solid piece of metal or copper heat pipes. Vapor Chambers are also more versatile than copper heat pipes in that they can be designed to be spread evenly across an entire chip that needs to be cooled.
Dual-intake, dual-exhaust airflow design: Our thin and light chassis prioritizes performance with a dual fan design that pulls in cool air from the top and bottom vents, and exhales exhaust out the rear and side vents for optimal cooling of the core components.
High voltage driving fan: The fire resistant, Kevlar-like liquid-crystal polymer fan blades include sleeve bearings, and 3-phase fan control to create less friction and circulate air more efficiently. There are now 132 unique fan blades to cool both the CPU and GPU.
Load-balancing heat pipes: The dynamics of thermal activity across critical components like the GPU and the CPU are intelligently discharged across four 3.5mm diameter copper-composite heat pipes.
Dense copper fin stacks: The new m15 has the greatest amount of copper material, by weight, dedicated to providing heat dissipation to core components than on any previous m15. The new m15 has also increased the size of its heat pipes by 40% to increase overall surface area and heat dissipation.