ASUS TUF GAMING B760-PLUS Motherboard - Intel Socket LGA1700, B760, 4 x DIMM slots, DP, HDMI, 128 Mb Flash ROM

$ 230.00
ASUS-90MB1ET0-M0EAY0

MPN #90MB1ET0-M0EAY0

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ASUS
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Reviews

Reviews

out of 5 stars

Key Features

  • LGA1700 Compatibility: The ASUS TUF GAMING B760-PLUS Motherboard is specifically designed for Intel processors, utilizing the LGA1700 socket for seamless compatibility with a variety of CPUs.
  • LGA1700 Compatibility: The ASUS TUF GAMING B760-PLUS Motherboard is specifically designed for Intel processors, utilizing the LGA1700 socket for seamless compatibility with a variety of CPUs.
  • Diverse Display Connectivity: Featuring DisplayPort (DP) and HDMI ports, the motherboard offers diverse display connectivity options, allowing users to configure their setups with ease and flexibility.
  • Sturdy Build for Gaming: As part of the TUF Gaming series, this motherboard is built with durability in mind, ensuring a reliable and stable platform for gaming enthusiasts.

Flash ROM for Easy Updates: The motherboard is equipped with a 128 MB Flash ROM, providing ample storage for the BIOS. This ensures convenient and secure updates, keeping your system's firmware up to date.

General

Memory (RAM)
Windows® 11, Windows® 10 64-bit
Memory (RAM)
4 x DIMM slots, Max. 192GB, DDR5 7200
Storage
2 x M.2 slots and 4x SATA 6Gb/s
BIOS
128 Mb Flash ROM, UEFI AMI BIOS
Manageability
WOL by PME, PXE
Ethernet
1 x Realtek 2.5Gb Ethernet
Audio
Realtek 7.1 Surround Sound High Definition Audio CODEC
Expansion Slots | Intel® B760 Chipset
1 x PCIe 4.0 x16 slot (supports x4 mode) 1 x PCIe 4.0 x1 slot
Rear USB
1 x USB 3.2 Gen 2x2 port (1 x USB Type-C®) 2 x USB 3.2 Gen 2 ports (2 x Type-A) 3 x USB 3.2 Gen 1 ports (3 x Type-A) 2 x USB 2.0 ports (2 x Type-A)
Front USB
1 x USB 3.2 Gen 2 connector (supports USB Type-C®)* 1 x USB 3.2 Gen 1 header supports additional 2 USB 3.2 Gen 1 ports 2 x USB 2.0 headers support additional 4 USB 2.0 ports*
Audio Features
Audio Shielding - Rear optical S/PDIF out port - Premium audio capacitors - Dedicated audio PCB layers
Form Factor
9.6 inch x 9.6 inch ( 24.4 cm x 24.4 cm )
Chipset
Intel B760
Wireless & Bluetooth
Wi-Fi 6 2x2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax) Supports 2.4/5GHz frequency band Bluetooth v5.2
Internal I/O Connectors | Miscellaneous
3 x Addressable Gen 2 headers 2 x Aura RGB headers 1 x Clear CMOS header 1 x COM Port header 1 x Front Panel Audio header (AAFP) 1 x S/PDIF Out header 1 x SPI TPM header (14-1pin) 1 x 20-5pin System Panel header 1 x Thunderbolt™ (USB4®) Header
Expansion Slots / Intel® 13th & 12th Gen Processors
1 x PCIe 5.0 x16 slot
Internal I/O Connectors | Fan and Cooling related
1 x 4-pin CPU Fan header 1 x 4-pin CPU OPT Fan header 1 x 4-pin AIO Pump header 3 x 4-pin Chassis Fan headers
Internal I/O Connectors | Power related
1 x 24-pin Main Power connector 1 x 8-pin +12V Power connector 1 x 4-pin +12V Power connector
Accessories | Cables
2 x SATA 6Gb/s cables
CPU
Intel® Socket LGA1700 for 13th Gen
Ports
1 x DisplayPort | 1 x HDMI port
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